Clearance Constraint (Gap=7.874mil) (All),(All)
Text "1" (4480mil,6290mil) Top Layer Pad TED1-2-1(4560mil,6320mil) Multi-Layer
Text "1" (4930mil,4520mil) Top Layer Pad TED2-2-1(4960mil,4440mil) Multi-Layer
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Hole Size Constraint (Min=1mil) (Max=100mil) (All)
Hole Size Constraint: Pad Free-4(2132mil,3140mil) Multi-Layer
Hole Size Constraint: Pad Free-3(7772mil,3140mil) Multi-Layer
Hole Size Constraint: Pad Free-2(7772mil,7590mil) Multi-Layer
Hole Size Constraint: Pad Free-1(2132mil,7590mil) Multi-Layer
Hole Size Constraint: Pad U2-(6456.38mil,5990.236mil) Multi-Layer
Hole Size Constraint: Pad U2-(3503.624mil,5990.236mil) Multi-Layer
Hole Size Constraint: Pad U2-(6456.38mil,4769.764mil) Multi-Layer
Hole Size Constraint: Pad U2-(3503.624mil,4769.764mil) Multi-Layer
Hole Size Constraint: Pad J4-1-3(2304.094mil,6640mil) Multi-Layer
Hole Size Constraint: Pad J4-1-1(2560mil,6640mil) Multi-Layer
Hole Size Constraint: Pad U1-6-(6849.804mil,7329.016mil) Multi-Layer
Hole Size Constraint: Pad U1-6-(6399.804mil,7330.08mil) Multi-Layer
Hole Size Constraint: Via (6120mil,3200mil) Top Layer to Bottom Layer
Hole Size Constraint: Via (5636.064mil,3200mil) Top Layer to Bottom Layer
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SMD Neck-Down Constraint (Percent=100%) (All)
SMD Neck-Down Constraint Between Pad on TopLayer And Track on TopLayer
SMD Neck-Down Constraint Between Pad on TopLayer And Track on TopLayer
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