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[WIFI模块]

Qualcomm QCN9074 MX6974 F5 PCI Express 3.0 802.11ax WIFI6 Module

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maxon2023|  楼主 | 2023-3-10 15:55 | 只看该作者 回帖奖励 |倒序浏览 |阅读模式
Description

​ ​MAXON MX6974 F5 Qualcomm QCN9074 802.11ax Embedded Wireless modules ​​that adopts M.2 E-key and supports PCI Express 3.0 protocol. It adopts Qualcomm QCN9074 802.11ax Wi-Fi technology, supports the 5180-5850GHz frequency band, has AP and STA functions with 4x4 MIMO and 4 spatial streams, suitable for applications of 5GHz IEEE802.11a/n/ac/ax.

It is equipped with a dynamic frequency selection (DFS) function which has higher transmission efficiency than the previous generation.

Specifications

Type: Wireless Module
Chip: QCN9074
IEEE Standard: IEEE 802.11ax
Connector: PCI Express 3.0, M.2 E-key
Working voltage: 3.3V/5V
Frequency range: 5G:5.180GHz~5.850GHz
Modulation technology:
802.11n:OFDM(BPSK,QPSK,16-QAM,64-QAM,256-QAM)
802.11ac:OFDM(BPSK,QPSK,16-QAM,64-QAM,256-QAM)
802.11ax:OFDMA (BPSK,QPSK,DBPSK,DQPSK,16-QAM,64-QAM, 256-QAM,1024-QAM,4096-QAM)
Power (per chain): 802.11ax:Max. 21dBm
Power consumption: ≦15W
Receiving Sensitivity:
11ax:
HE20 MCS0 <-89dBm / MCS11 <-64dBm
HE40 MCS0 <-89dBm / MCS11 <-60dBm
HE80 MCS0 <-86dBm / MCS11 <-58dBm
Antenna Connector: 4 x U. FL
Operating Environment: Temperature: -20°C to 70°C/-4 ~ 158℉; Humidity: 95% (non-condensing)
Storage Environment: Temperature: -40°C to 90°C/-40 ~ 194℉; Humidity: 90% (non-condensing)
Certification: RoHS/REACH
Weight: 20g
Dimensions (W*H*D): 60 x 57 x 4.2 mm (±0.1mm)

使用特权

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