六、流程
1.开料:CutLamination/Material cutting 2.钻孔:Drilling 3.内钻:Inner LayerDrilling 4一次孔:Outer Layer Drilling 5.二次孔:2nd Drilling 6.雷射钻孔:Laser Drilling /Laser Ablation 7.盲(埋)孔钻孔:Blind & Buried Hole Drilling 8.干膜制程:PhotoProcess(D/F)/Dry Film 9.前处理 (Pretreatment) 10.压膜:Dry Film Lamination 11.曝光:Exposure 12.显影:Developing 13.去膜:Stripping 14.压合:Lamination 15:黑化:Black OxideTreatment 16.微蚀:Microetching 17.铆钉组合:eyelet 18.迭板:Lay up 19.压合:Lamination 20.后处理:Post Treatment 21.黑氧化:Black Oxide Removal 22.铣靶:spot face 23.去溢胶:resin flush removal 24.减铜:Copper Reduction 25.水平电镀:HorizontalElectrolytic Plating 26.电镀:Panel plating 27.锡铅电镀:Tin-Lead Plating /Pattern Plating 28.低于 1 mil: Less than 1 mil Thickness 29.高于 1 mil:More than 1 mil Thickness 30.砂带研磨:Belt Sanding 31:剥锡铅:Tin-Lead Stripping 32.微切片: Microsection 33.蚀铜:Etching 34.初检:Touch-up 35.塞孔:Plug Hole 36.防焊(绿漆/绿油):SolderMask 37.C面印刷:Printing Top Side 38.S面印刷:Printing Bottom Side 39.静电喷涂:Spray Coating 40.前处理:Pretreatment 41.预烤:Precure 42.后烘烤:Postcure 43.印刷:Ink Print 44.表面刷磨:Scrub 45.后烘烤:Postcure 46.UV烘烤:UV Cure 47.文字印刷:Printing of Legend 48.喷砂:Pumice/Wet Blasting 49.印可剥离防焊/蓝胶:Peelable Solder Mask) 50.化学前处理,化学研磨:Chemical Milling 51.选择性浸金压膜:Selective Gold Dry Film Lamination 52.镀金:Gold plating 53.喷锡:Hot Air SolderLeveling 54.成型:Profile/Form 55.开短路测试:Electrical Testing 56.终检:Final VisualInspection 57.金手指镀镍金:Gold Finger 58.电镀软金:Soft Ni/Au Plating 59.浸镍金:Immersion Ni/Au / Electroless Ni/Au 60.喷锡:Hot Air Solder Leveling 61.水平喷锡:HorizontalHot Air Solder Leveling 62.垂直喷锡: Vertical Hot Air Solder Leveling 63.超级焊锡:Super Solder 64.印焊锡突点:Solder Bump 65.数控铣/锣板:N/C Routing/Milling 66.模具冲/啤板:Punch 67.板面清洗烘烤:Cleaning & Backing 68.V型槽/V-CUT: V-Cut/V-Scoring 69.金手指斜边:Beveling of G/F 70.短断路测试Electrical Testing/Continuity & Insulation Testing 71.AOI 光学检查:AOI Inspection 72:VRS 目检:Verified & Repaired 73.泛用型治具测试:Universal Tester 74.专用治具测试:Dedicated Tester 75.飞针测试:Flying Probe 76.终检:Final Visual Inspection 77.压板翘:Warpage Remove 78.X-OUT 印刷:X-Out Marking 79.包装及出货:Packing& shipping 80.清洗及烘烤: Final Clean & Baking 81.铜面保护剂:ENTEK Cu-106A/OSP 82.离子残余量测试:Ionic Contamination Test/ Cleanliness Test 83.冷热冲击试验:Thermal cycling Testing 84.焊锡性试验:Solderability Testing 85.雷射钻孔:Laser Ablation 86.雷射钻Tooling孔:Laser ablationTooling Hole 87.雷射曝光对位孔:Laser Ablation Registration Hole 88.雷射Mask制作:Laser Mask 89.雷射钻孔:Laser Ablation 90.AOI检查及VRS:AOI Inspection & Verified & Repaired 91.除胶渣:Desmear 92.专用治具测试:Dedicated Tester 93.飞针测试:Flying Probe 94.压板翘: Warpage Remove 95.底片:Ablation 96.烧溶:laser) 97.切/磨:abrade 98.粗化:abrasion 99.耐磨性:absorption resistance 100.允收:ACC /accept 101.加速腐蚀:accelerated corrosion test 102加速试验:accelerated test 103.速化反应:acceleration 104.加速剂:accelerator 105.允许:acceptable 106.活化液:activator 107.实际在制品:active work in process 108.附着力:adhesion 109.黏着法:adhesive method 110.气泡:air inclusion 111.风刀:air knife 112.不定形的改变:amorphous change 113.总量:amount 114.硝基戊烷:amylnitrite 115.分析仪:analyzer 116环状垫圈;孔环annular ring 117.阳极泥:anodeslime (sludge) 118.阳极清洗:anodizing 119.自动光学检测:AOI/automatic optical inspection 120.引用之文件:applicable documents 121.允收水平抽样:AQL sampling 122.液态光阻:aqueous photoresist 123.纵横比(厚宽比):aspect ratioAs received 124.背光:back lighting 125.垫板:back-up 126.预留在制品:banked work in process 127.基材:base material 128.基准绩效:baseline performance 129.批:batch 130.贝他射线照射法:beta backscattering 131.切斜边;斜边:beveling 132.二方向之变形:biaxial deformation 133.黑化:black-oxide 134.空板:blank panel 135.挖空:blanking 136.弹开:blip 137.气泡:blister blistering 138.吹孔:blow hole 139.板厚错误:board-thickness error 140.黏结层:bonding plies 141.板弯:bow ; bowing 142.破空:break out 143.搭桥;桥接:bridging 144.接单生产:BTO (Build To Order) 145,.烧焦:burning 146.毛边(毛头):burr 147.碳化物:carbide 148.定位梢:carlson pin 149.载运剂:carrier 150.催化:catalyzing 151.阴极溅射法:catholicsputtering 152.隔板;钢板:caul plate 153.校验系统之各种要求:calibration system requirements 154.中心光束法:center beam method 155.集中式投射线:central projection 156.认证:certification 157.倒角 (金手指):chamfer chamfer 158.切斜边;倒角:chamfering 159.特性阻抗:characteristic impedance 160.电量传递过电压:charge transfer overpotential 161.网框:chase 162.棋盘:checkboard 163.蟹和剂:chelator 164.化学键:chemical bond 165.化学蒸着镀:chemical vapor deposition 166.圆周性之孔破:circumferential void 167.包夹金属:clad metal 168.无尘室:clean room 169.间隙:clearance 170.表面处理:Coating/Surface Finish
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