#申请原创# #技术资源# @21小跑堂 G32R501与TMS320f280049 ESD测试报告对比,孰高孰低立见分晓
实验1:HBM人体放电模型测试实验 测试对象:1.Geehy_G32R501单芯片ESD方案,2.TMS320f280049单芯片ESD方案 测试方法:在MK2机台,根据芯片数据手册梳理所有管脚耐压值,电源、IO属性形成pinlist。梳理完pinlist,按照如下组合分配管脚, All Other Pins To VSS(±)500V~8000V,Step 500V | All Other Pins To VSSA(±)500V~8000V,Step 500V | All Other Pins To VSSIO(±)500V~8000V,Step 500V | All Other Pins To VDD(1.2V)(±)500V~8000V,Step 500V | All Other Pins To VDDIO(3.6V)(±)500V~8000V,Step 500V | All Other Pins To VDDA(3.6V)(±)500V~8000V,Step 500V | IO To IO(±)500V~8000V,Step 500V |
根据表格pin组合以及步进,pin组合是根据JS-001标准实施,MK2机台执行测试。 调试好自动化测试程序 需设置的参数为(以下来源于数据手册,可公开): | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | 1,10,100,13,14,15,16,17,18,19,2,20,21,22,23,24,25,26,27,28,29,30,31,32,35,36,37,38,39,40,41,42,43,44,48,49,50,51,52,53,54,55,56,57,58,59,6,60,61,62,63,64,65,66,67,68,69,7,73,74,75,76,77,78,79,8,81,83,84,85,89,9,90,91,92,93,94,95,96,97,98,99 |
测试结果如下: 1. Geehy_G32R501单芯片HBM结果(ESD结果会有三方实验室报告,可以对外): | | | | All Other Pins To VSS(±)500V~8000V,Step 500V | | | | All Other Pins To VSSA(±)500V~8000V,Step 500V | All Other Pins To VSSIO(±)500V~8000V,Step 500V | All Other Pins To VDD(1.2V)(±)500V~8000V,Step 500V | All Other Pins To VDDIO(3.6V)(±)500V~8000V,Step 500V | All Other Pins To VDDA(3.6V)(±)500V~8000V,Step 500V | IO To IO(±)500V~8000V,Step 500V |
2.TMS320f280049单芯片HBM结果: | | | | All Other Pins To VSS_PIN5(±)1000V~6500V,Step 500V | | | IO(4.6V)_FLT1 IV short fail at 6500V(Zap to IO) for #1 | All Other Pins To VSS_PIN45(±)1000V~6500V,Step 500V | All Other Pins To VSS_PIN72(±)1000V~6500V,Step 500V | All Other Pins To VSS_PIN86(±)1000V~6500V,Step 500V | All Other Pins To VSSA_PIN12(±)1000V~6500V,Step 500V | All Other Pins To VSSA_PIN33(±)1000V~6500V,Step 500V | All Other Pins To VSS_SW(±)1000V~6500V,Step 500V | All Other Pins To VDD(1.5V)_PIN4(±)1000V~6500V,Step 500V | All Other Pins To VDD(1.5V)_PIN46(±)1000V~6500V,Step 500V | All Other Pins To VDD(1.5V)_PIN71(±)1000V~6500V,Step 500V | All Other Pins To VDD(1.5V)_PIN84(±)1000V~6500V,Step 500V | All Other Pins To VDDIO(4.6V)_PIN3(±)1000V~6500V,Step 500V | All Other Pins To VDDIO(4.6V)_PIN47(±)1000V~6500V,Step 500V | All Other Pins To VDDIO(4.6V)_PIN70(±)1000V~6500V,Step 500V | All Other Pins To VDDIO(4.6V)_PIN88(±)1000V~6500V,Step 500V | All Other Pins To VDDA(4.6V)_PIN11(±)1000V~6500V,Step 500V | All Other Pins To VDDA(4.6V)_PIN34(±)1000V~6500V,Step 500V | All Other Pins To VDDIO_SW(4.6V)(±)1000V~6500V,Step 500V | IO_Group_1 To IO_Group_1(±)1000V~6500V,Step 500V |
实验2:CDM带电器件模型测试(ESD结果会有三方实验室报告,可以对外) 1、Geehy_G32R501单芯片CDM结果 | | | | CDM 250V~2000V;Step:250V FOR ALL 100 PINS | | | |
2、TMS320f280049单芯片CDM结果: 实验3:LU闩锁效应(ESD结果会有三方实验室报告,可以对外) 1、Geehy_G32R501单芯片LU结果 | | | | | | | | | | | | | | | | | | | | | | | | | | Vsupply Over-voltage test | | | | | | |
2、TMS320f280049单芯片LU结果: | | | | | | | | | | | | | | Vsupply Over-voltage test | | | | | | |
总结 从整体的ESD测试结果来看,对比TMS320f280049单芯片ESD结果,G32R501在HBM/CDM均比TMS320f280049的高出多个level。从未来芯片应用上,抗ESD能力明显强于TI TMS320f280049,LU测试结果一致,两者比较接近。 总结起来,从HBM/CDM来看,G32R501抗静电能力远远优于TMS320f280049,可以支持用户应用于ESD要求高的场景。分开来讲:HBM高芯片能承受更高的人体静电电压(如>2000V,甚至8000V),降低因操作不当(如组装、维修)导致的损坏风险;CDM:在高速贴片、封装过程中不易因静电放电损坏(如>500V CDM是常见工业要求)。
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