专家回复：The DFN package is the design trend for the slim type device , the DFN package is popular in this kind of design now and it will be the mainstream in the future.
专家回复：The power loss include the conduction loss and switching loss.
for load switch application , the conduction loss is the key factor.
The lower Rds(on) helps to reduce the power dissipation.
专家回复：DFN package provide the bigger pad in bottum side , the heat could go through the PCB to disappear the heat ,
so the power dissipation capability is better than the normal package , the higher power dissipation capability will get the higher Id current.
楼主
标题置顶
标题高亮
