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http://www.arm.com/community/ARM_Core_Licensees.php<br /><br />Public ARM Processor Licensees and Foundries<br /><br /><br />3Com Corporation<br />5V Technologies Ltd.<br />A<br />Accent S.p.A.<br />Actel Corporation<br />Acute Technology Corporation<br />ADTechnology Co Ltd<br />Agere Systems<br />AKM Semiconductor, Inc.<br />Alereon, Inc.<br />Alpha Imaging Technology Corp.<br />Altera Corporation<br />AMI Semiconductor Inc<br />Analog Devices Inc<br />Anyka Cayman Corporation<br />ARCA Technology Corporation<br />ArrayComm LLC<br />Atheros Communications, Inc.<br />Atmel Corporation<br />austriamicrosystems<br />Avago Technologies<br />B<br />Beijing University of Technology<br />Broadcom Corporation<br />C<br />Cambridge Silicon Radio<br />Canadian Microelectronics Corporation (CMC)<br />CEC Huada Electronic Design Co., Ltd (HEC)<br />Celestial Semiconductor, Inc.<br />Centrality Communications<br />CeRoma<br />Chartered Semiconductor Mfg. (Foundry Partner)<br />Chipnuts Technology Inc.<br />Chongquig Chongyou Information Technology Co., Ltd<br />Cirrus Logic Inc.<br />Conexant Systems, Inc.<br />Cypress Semiconductor Corp.<br />D<br />Datang Telecom Technology Co. Ltd.<br />Dongbu Electronics (Foundry Partner)<br />DSP Group, Inc.<br />E<br />eSilicon Corporation<br />ETRI (Electronics and Telecommunications Research Institute)<br />F<br />Faraday Technology Corporation<br />Flextronics Semiconductor<br />Focus Enhancements Semiconductor Group<br />Freescale Semiconductor, Inc.<br />Fudan University<br />Fujitsu Microelectronics America, Inc.<br />G<br />GCT Semiconductor, Inc.<br />Global Unichip Corp.<br />Goodrich Corporation<br />Grace Semiconductor Manufacturing Corporation (Foundry Partner)<br />H<br />Hangzhou Silan Microelectronics Co., Ltd.<br />HeJian Technology (Suzhou) Co., Ltd. (Foundry Partner)<br />Hong Kong Science and Technology Parks Corporation<br />HuaWei Technologies Co., Ltd.<br />Huconex Co., Ltd.<br />Hynix Semiconductor Inc.<br />I<br />ICP Electronics, Inc.<br />Industrial Technology Research Institute (ITRI)<br />Infineon Technologies AG<br />Intel Corporation<br />International Business Machines Corporation<br />Intrinsix Corporation<br />iSine Inc.<br />J<br />Jazz Semiconductor (Foundry Partner)<br />K<br />Kawasaki Microelectronics, Inc.<br />Key Asic Inc.<br />L<br />LG Electronics<br />LSI Logic Corporation<br />Luminary Micro, Inc.<br />M<br />Macronix International Co., Ltd.<br />Marvell Semiconductor, Inc.<br />Matsushita Electric Industrial Co., Ltd.,<br />MediaTek Inc.<br />Micrel Semiconductor<br />Micronas GmbH<br />MIMOS Berhad<br />Mindspeed Technologies, Inc.,<br />MobilEye Vision Technologies Ltd<br />Mobilygen Corporation<br />MosChip Semiconductor Technology Ltd.,<br /> <br />N<br />Nanoradio, AB<br />National Chip Implementation Centre<br />National Semiconductor Corporation<br />NEC Electronics (Europe) GmbH<br />NeoMagic Corporation<br />Nethra Imaging, Inc.<br />NuCORE Technology, Inc.<br />NVIDIA Corporation<br />NXP Semiconductors<br />O<br />Oki Electric Industry Co.,Ltd.<br />Open-Silicon, Inc.<br />Oxford Semiconductor<br />P<br />Phoenix Microelectronics (China) Co., Ltd<br />picoChip Designs Limited<br />Pixim, Inc.<br />Progate Group Corporation<br />Pulse~LINK, Inc.<br />Q<br />Qualcomm Inc.<br />R<br />Renesas Technology America, Inc.<br />RF Micro Devices, Inc.<br />Rohm Co., Ltd.<br />S<br />Samsung Semiconductor, Inc.<br />Sandbridge Technologies<br />SanDisk Corporation<br />SangHwa Micro Technology Inc.<br />SANYO Electric Co., Ltd.<br />Sarnoff Corporation<br />Seiko Epson Corporation<br />Semiconductor Manufacturing International Corporation (Foundry Partner)<br />SEQUANS Communications<br />Shanghai Anchuang Information Technology Co., Ltd<br />Shanghai Fudan Microelectronics Ltd.<br />Shanghai Hua Hong NEC Electronics Company Limited (Foundry Partner)<br />Shanghai HuaHong Integrated Circuit Co., Ltd.<br />Shanghai Jade Technologies Co, Ltd.<br />Shanghai Jiao Tong University<br />Shanghai Research Center for Integrated Circuit Design<br />Shanghai Silicon IP Technologies Co., Ltd<br />Sharp Microelectronics of the Americas<br />Shenyang Institute of Automation<br />Shenzen ZTE IC Design Co., Ltd.<br />Shenzhen State Micro Technology Co., Ltd<br />SigmaTel, Inc.<br />Silicon Integrated Systems Corporation<br />Silicon Laboratories, Inc.<br />Silicon Storage Technology, Inc.<br />Silterra Malaysia Sdn. Bhd. (Foundry Partner)<br />SiRF Technology, Inc.<br />Skyworks Solutions, Inc.<br />SMSC<br />Socle Technology Corporation<br />Solomon Systech Limited<br />Southeast University<br />Spansion, Inc.<br />Speed Pixel Technology Ltd.<br />Spreadtrum Communications Inc.<br />Staccato Communications, Inc.<br />Stepmind SA<br />STMicroelectronics<br />Sunplus Technology Co., Ltd<br />T<br />Taiwan Semiconductor Manufacturer Corporation Limited (Foundry Partner)<br />Teknovas, S.A.<br />Telegent Systems, Inc.,<br />Texas Instruments<br />Thomson<br />Toshiba America Electronic Components<br />Tower Semiconductor Ltd. (Foundry Partner)<br />U<br />United Microelectronics Corporation (Foundry Partner)<br />V<br />Vanguard International Semiconductor Corporation (Foundry Partner)<br />VeriSilicon, Inc.<br />VIA Telecom, Inc.<br />W<br />Wavecom SA<br />Winbond Electronics Corporation<br />Wipro<br />Wisair<br />X<br />X-FAB Silicon Foundries (Foundry Partner)<br />Y<br />Yamaha Corporation<br />Z<br />Zarlink Semiconductor, Inc.<br />ZiLog, Inc.<br />Zoran Corporation
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