1. BGA 球栅阵列封装 (Ball Grid Array Package )
2. CBGA 陶瓷焊球阵列封装 (Ceramic Pin Grid Arrau)
3. CERDIP 陶瓷熔封双列 (Ceramic Dual Inline Package)
4. CFP 陶瓷扁平封装(Ceramic Flat Pockage)
5. CLCC 陶瓷无引线片式载体(Ceramic Leaded Chip Carrier)
6. CSP 芯片缩放式封装(Chip Size Package)
7. COB 板上芯片贴装(Chip On Board)
8. COC 瓷质基板上芯片贴装(Chip on Chip)
9. CPGA 陶瓷针栅阵列封装(Ceramic Pin Grid Arrau Package)
10.CQFP 陶瓷四边引线扁平(Ceramic Quad Flat Pockage)
11.DIP 双列直插式封装(Dual In-line Package)
12.FCOB 板上倒装片(Flip Chip on Board)
13.LCC 无引线片式载体(Leaded Chip Carrier)
14.MCM 多芯片模型贴装(Multichip Module)
15.PBGA 塑料焊球阵列封装(Plastic Ball Grid Array Package)
16.PGA 插针网格阵列封装技术(Pin Grid Arrau Package)
17.PLCC(Plastic Leaded Chip Carrier)
18.PQFP 塑料四边引线封装(Plastic Quad Flat Pockage)
19.QFP 方型扁平式封装技术(Quad Flat Pockage)
20.SDIP 小型双列直插封装(Small Dual In-line Package)
21.SIP 单列直插封装(Single Inline Package)
22.SO 小外形封装(Small Outline Package)
23.SOJ 塑料J形线封装(Small Outline J-Lead Package)
24.SOP 小外形外壳封装(Small Outline Package)
25.SSOP 窄间距小外型塑封(Shrink Small Outline Package)
26.TQFP 扁平簿片方形封装(Thin Quad Flat Pockage)
27.TSOP 薄形小外形外壳封装(Thin Small Outline Package)
28.TSSOP(Plastic Thin Small Outline Package)
29.WLCSP 晶圆片级芯片规模封装
30.ZIP Z形直插封装(Zig-Zag Inline Package)