本帖最后由 香水城 于 2015-7-23 17:48 编辑
哈哈，我不打LZ的脸，我要感谢LZ，手册看的还是蛮仔细的，并且在有疑问的时候，能够发帖公开讨论。所谓：真理，越辩越明嘛。
第一个问题：
请看STM32F1的参考手册中的定义：（这段话在基本每个章节前面都有哦）
Low-density devices are STM32F101xx, STM32F102xx and STM32F103xx
microcontrollers where the Flash memory density ranges between 16 and 32 Kbytes.
Medium-density devices are STM32F101xx, STM32F102xx and STM32F103xx
microcontrollers where the Flash memory density ranges between 64 and 128 Kbytes.
High-density devices are STM32F101xx and STM32F103xx microcontrollers where the
Flash memory density ranges between 256 and 512 Kbytes.
XL-density devices are STM32F101xx and STM32F103xx microcontrollers where the
Flash memory density ranges between 768 Kbytes and 1 Mbyte.
Connectivity line devices are STM32F105xx and STM32F107xx microcontrollers.
105/107就是互联型，不管它的片上闪存有多小，有多大。
第二个问题：
在STM32F1的参考手册里，第三章（memory and bus architecuture）的第三节（memory map），这么众多的表格里，请看表7：flash module organization(connectivity line device)
里面清清楚楚写的闪存的每个page是2Kbyte
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