Robust System Thermal Management
可靠的系统热管理
By Sachin Gupta， Cypress Semiconductor
作者：Sachin Gupta，赛普拉斯半导体
Today， process technology has advanced to 32nm， resulting in an increase in the number of transistors per unit area and a reduction in package size. At the same time， system designers are trying their best to reduce the system size by increasing the component density on boards， adding as many features in the design as possible to deliver the industries’ best products in terms of space and size. Increased transistor density inside the chip， higher operating speeds， and increased component density on board in modern electronic systems has led to relatively more heat being generated in these systems. All this has made thermal management an integral and critical part of system management in all application domains， including automotive， industrial control， consumer electronics， battery powered systems， and so on. Many systems are equipped with cooling fans to deal with the heat generated. This has led designers to realize the need to come up with cost-effective， reliable， noise-free，
and power efficient temperature-based closed loop fan control systems.
今天，工艺技术相当先进了，已经有了32纳米技术，单位面积的晶体管数目增加了，封装尺寸减小了。与此同时，系统设计者正在竭尽全力地通过增加板上器件密度来降低系统尺寸，并尽可能多的增加设计特色，在空间和大小方面提供业界最好的产品。在现代电子系统中，增加片内晶体管密度、较高的操作速度、增加板上器件密度，这些将导致系统产生较多的热量。这一切使热管理成为所有系统管理应用领域中的整体和关键部分，包括汽车领域、工业控制、消费电子、电池系统，等等。许多系统配备冷却风扇来处理所产生的热量。这使得设计人员要意识到必须设计出性价比高的、可靠的、无噪音的、电源效率高的闭环风扇控制系统。 |
楼主
标题置顶
标题高亮
