The demand for smaller PCB sizes with finer-pitch layouts, the range and mix of surface mount components as well as the increasingly shorter product life cycles and corresponding greater number of changeovers, presents challenges for the process engineer.
具有细间距布局的更小尺寸的PCB的需求，表面贴装元件的范围和结构以及越来越短产品生命周期和相应数量更大的换线，对工艺工程师提出了挑战。
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