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高速串行总线PCI Express技术讲座<br /><br />时间：10月19日下午：13：30－16：30<br />地点：北京丽亭华苑大酒店三层金辉厅B会场<br />主题：高速串行总线PCI Express技术讲座<br /><br />特邀代表演讲：<br /> 陈少民 北京半导体行业协会 特聘顾问<br /> 美国华美半导体协会会长<br />内容简介：<br /> 整个半导体产业接口总线技术正在由并行总线向串行总线转变，串行总线技术将成为未来十年产业发展的主流。如USB、GE、SATA、HDMI和PCI Express等技术已被业界广泛采纳。尤其是从PCI总线演变而来PCI Express技术，由于具有告诉带宽的优势，可以广泛地应用于笔记本电脑、桌面电脑、网络、通信和嵌入式系统中。目前已成为一项非常关键的技术。本讲座的主要内容为：<br />1、PCI Express的市场及应用；<br />2、PCI Express技术的基础；<br />3、PCI Express中交换、分组交换、桥联与Re－Drvier<br /><br />参会者请提前报名预约：<br />报名电话：010－82351166<br />报名邮件：ictrain@bjicpark.com<br /><br />【注：报名时请提供姓名、公司和联系方式】<br /><br /> ABSTRACT<br /> A PCI Express Technical and Applications Seminar<br /><br />Today, the semiconductor industry is in the high integration SOC (System on Chip) era. There are two (2) main SOC categories that are in critical demand across many markets: <br /><br />1) CPU/Memory<br />2) I/O peripheral. <br /> Due to the big improvement of faster CPU speed and memory, it drives the mega trend of I/O peripheral bus for much bigger bandwidth to move the data in and out of the CPU at much faster speeds. This I/O mega trend is driven by the movement from legacy (older) parallel bus, to the new serial bus protocols. <br /><br /> These new serial bus protocols are applied in different fields, such as Gigabit Ethernet in networking, SATA in hard disk, SAS in storage networking, etc. Among these new serial buses, one of biggest impacts is the migration from parallel PCI to serial PCI Express. PCI Express is a high speed, ‘scalable’, andwide bandwidth protocol, with Gen1 speed of 2.5Gb/s, Gen2 speed of 5Gbit/s, and even Gen3 in the future with 10Gb/s. PCI Express applications are found across Computing, Communication and Consumer markets.<br /> For example, laptop and desktop in Computing, networking and telecom backplane in Communication, and surveillance camera and Set-Top-Box in Consumer. The impact of this technology transition is critical to the entire industry and to the individual who uses it. <br /><br />The content of this seminar/tutorial consists of the following sessions:<br /><br /><br />1. PCI Express Transition, Market, and Applications (40 mins)<br /><br /><br /><br />2. PCI Express Technology Fundamentals (1 hour)<br /><br /><br /><br />3. PCI Express Challenges and Solutions (1 hour)<br /><br /><br /><br /> Session 1 discusses PCI Express technology migration from PCI. The potential market and realization will be explored. The technology and applications in Computing, Communication and Consumer fields will be discussed. The simple diagram will be illustrated when market and applications is presented.<br /><br /> Session 2 introduces PCI Express technology, from the key spec, bandwidth, features and basic protocols. PCIe system architecture and topology will be introduced as well as packet flow within the systems. The behavior and interaction of Physical Layer, MAC Layer, Data Link Layer (DLL) and Transaction Layer (TL) will be discussed. In addition, the Quality of Service (QoS) of PCIe will be presented by introducing the concept of Virtual Channel (VC) and Traffic Class (TC) mapping incorporated with Port and VC arbitration algorithms.<br /><br /><br /> Session 3 explores the challenges of PCI Express. Especially, it will be discussed from the perspective of PCB design, focusing on the challenges of high-speed series bus design. For example, preserving signal integrity and reducing EMI issues are difficult concepts for the high-speed design engineer. EMI & signal integrity solutions and proposals will be illustrated. <br /><br /><br />Speakers Biography<br /><br /><br />Michael Chen<br /><br /> Michael Chen is Vice President of ASIC Engineering & General Manager of Pericom Semiconductor Corp. (NSDQ: PSEM). Prior to Pericom, Michael was with Lattice Semiconductor Corp as Department Manager of FPGA. Before Lattice, has been with start-up companies, they are CrossCheck & LogicVision, targeting at SOC IP & ASIC verification, as various management positions, like Director and Vice President. LogicVision went public (NSDQ: LGVN) and CorssCheck was acquired. Before that he was with Cadence as Engineering Manger. Michael earned the Annual Best Product Award for EDN 94. Michael served as Chairman & President of CASPA (Chinese American Semiconductor Professional Association) of 2001~2002. Michael ever served Taiwan NSC SOC tutorial coordinator and CIC advisor. He deeply involved NSC and NII published Taiwan SOC White-Paper (1999 ~2002). Michael serves as an Advisor of China National Beijing IC Design Base. He is holding the title of Guest Professor of Shanghai Jiao Tong University. Ever offered class in Beijing Tisnghua University and National Taiwan Chiao Tong University.<br />Published book “SOC/IP Design Methodology”. Michael received MS Electric Engineering from Penn State University.<br /> |
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