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PCB专业英语<br /><br /><br />流程简介：开料－－钻孔－－干膜制程－－压合－－减铜－－电镀－－塞孔－－防焊(绿漆/绿油)<br /><br /> －－镀金－－喷锡－－成型－－开短路测试－－终检－－雷射钻孔<br /><br />A. 开料( Cut Lamination)<br />a-1 裁板( Sheets Cutting)<br />a-2 原物料发料(Panel)(Shear material to Size)<br /><br />B. 钻孔(Drilling)<br />b-1 内钻(Inner Layer Drilling )<br />b-2 一次孔(Outer Layer Drilling )<br /><br />b-3 二次孔(2nd Drilling)<br /><br />b-4 雷射钻孔(Laser Drilling )(Laser Ablation )<br /><br />b-5 盲(埋)孔钻孔(Blind & Buried Hole Drilling)<br /><br />C. 干膜制程( Photo Process(D/F))<br />c-1 前处理(Pretreatment)<br /><br />c-2 压膜(Dry Film Lamination)<br /><br />c-3 曝光(Exposure)<br /><br />c-4 显影(Developing)<br /><br />c-5 蚀铜(Etching)<br /><br />c-6 去膜(Stripping)<br /><br />c-7 初检( Touch-up)<br /><br />c-8 化学前处理,化学研磨( Chemical Milling )<br /><br />c-9 选择性浸金压膜(Selective Gold Dry Film Lamination)<br /><br />c-10 显影(Developing )<br /><br />c-11 去膜(Stripping )<br /><br />Developing , Etching & Stripping ( DES )<br /><br />D. 压合Lamination<br />d-1 黑化(Black Oxide Treatment)<br /><br />d-2 微蚀(Microetching)<br /><br />d-3 铆钉组合(eyelet )<br /><br />d-4 叠板(Lay up)<br /><br />d-5 压合(Lamination)<br /><br />d-6 后处理(Post Treatment)<br /><br />d-7 黑氧化( Black Oxide Removal )<br /><br />d-8 铣靶(spot face)<br /><br />d-9 去溢胶(resin flush removal)<br /><br />E. 减铜(Copper Reduction)<br />e-1 薄化铜(Copper Reduction)<br /><br />F. 电镀(Horizontal Electrolytic Plating)<br />f-1 水平电镀(Horizontal Electro-Plating) (Panel Plating)<br /><br />f-2 锡铅电镀( Tin-Lead Plating ) (Pattern Plating)<br /><br />f-3 低于1 mil ( Less than 1 mil Thickness )<br /><br />f-4 高于1 mil ( More than 1 mil Thickness)<br /><br />f-5 砂带研磨(Belt Sanding)<br /><br />f-6 剥锡铅( Tin-Lead Stripping)<br /><br />f-7 微切片( Microsection)<br /><br />G. 塞孔(Plug Hole)<br />g-1 印刷( Ink Print )<br /><br />g-2 预烤(Precure)<br /><br />g-3 表面刷磨(Scrub)<br /><br />g-4 后烘烤(Postcure)<br /><br />H. 防焊(绿漆/绿油): (Solder Mask)<br />h-1 C面印刷(Printing Top Side)<br /><br />h-2 S面印刷(Printing Bottom Side)<br /><br />h-3 静电喷涂(Spray Coating)<br /><br />h-4 前处理(Pretreatment)<br /><br />h-5 预烤(Precure)<br /><br />h-6 曝光(Exposure)<br /><br />h-7 显影(Develop)<br /><br />h-8 后烘烤(Postcure)<br /><br />h-9 UV烘烤(UV Cure)<br /><br />h-10 文字印刷( Printing of Legend )<br /><br />h-11 喷砂( Pumice)(Wet Blasting)<br /><br />h-12 印可剥离防焊(Peelable Solder Mask)<br /><br />I . 镀金Gold plating<br />i-1 金手指镀镍金( Gold Finger )<br /><br />i-2 电镀软金(Soft Ni/Au Plating)<br /><br />i-3 浸镍金( Immersion Ni/Au) (Electroless Ni/Au)<br /><br />J. 喷锡(Hot Air Solder Leveling)<br />j-1 水平喷锡(Horizontal Hot Air Solder Leveling)<br /><br />j-2 垂直喷锡( Vertical Hot Air Solder Leveling)<br /><br />j-3 超级焊锡(Super Solder )<br /><br />j-4. 印焊锡突点(Solder Bump)<br /><br />K. 成型(Profile)(Form)<br />k-1 捞型(N/C Routing ) (Milling)<br /><br />k-2 模具冲(Punch)<br /><br />k-3 板面清洗烘烤(Cleaning & Backing)<br /><br />k-4 V型槽( V-Cut)(V-Scoring)<br /><br />k-5 金手指斜边( Beveling of G/F)<br /><br />L. 开短路测试(Electrical Testing) (Continuity & Insulation Testing)<br />l-1 AOI 光学检查( AOI Inspection)<br /><br />l-2 VRS 目检(Verified & Repaired)<br /><br />l-3 泛用型治具测试(Universal Tester)<br /><br />l-4 专用治具测试(Dedicated Tester)<br /><br />l-5 飞针测试(Flying Probe)<br /><br />M. 终检( Final Visual Inspection)<br />m-1 压板翘( Warpage Remove)<br /><br />m-2 X-OUT 印刷(X-Out Marking)<br /><br />m-3 包装及出货(Packing & shipping)<br /><br />m-4 目检( Visual Inspection)<br /><br />m-5 清洗及烘烤( Final Clean & Baking)<br /><br />m-6 护铜剂(ENTEK Cu-106A)(OSP)<br /><br />m-7 离子残余量测试(Ionic Contamination Test )(Cleanliness Test)<br /><br />m-8 冷热冲击试验(Thermal cycling Testing)<br /><br />m-9 焊锡性试验( Solderability Testing )<br /><br />N. 雷射钻孔(Laser Ablation)<br />N-1 雷射钻Tooling孔(Laser ablation Tooling Hole)<br /><br />N-2 雷射曝光对位孔(Laser Ablation Registration Hole)<br /><br />N-3 雷射Mask制作(Laser Mask)<br /><br />N-4 雷射钻孔(Laser Ablation)<br /><br />N-5 AOI 检查及VRS ( AOI Inspection & Verified & Repaired)<br /><br />N-6 Blaser AOI (after Desmear and Microetching)<br /><br />N-7 除胶渣(Desmear)<br /><br />N-8 微蚀(Microetching )<br /> |
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