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AEC-Q102与AEC-Q101区别一览表 | | | | 对象：车用分立半导体元器件
晶体管:BJT、MOSFET、IGBT
二极管：Diodes、Rectifier、Zeners、PIN、Varactors
光器件：LEDs、Optocoupler、Photodiodes、Phototransistors
| 对象：车用分立光电半导体元器件
Light Emitting Diodes、Laser Components、Photodiodes、Phototransistors
| | 环境应力试验：3lot×77pcs/lot
LTPD(Lot Tolerance Percent Defective) = 1, 90%置信度的失效率为1%
| 环境应力试验：3lot×26pcs/lot
LTPD (Lot Tolerance Percent Defective) = 3, 90%置信度的失效率为3% | | 不符合规格书规定的电学和光学参数范围
环境试验前后参数值变化未保持在±20%以内；漏电未保持在5倍初始值以内（对于湿气试验为10倍）
由于环境试验出现物理损坏
如果失效原因被供应商和用户认为是由于处理不当或ESD的原因引起，这些失效可以被忽略，但应呈现在报告中
| 不符合规格书规定的电学和光学参数范围
环境试验前后参数值变化未保持在附录5规定的±x%以内
由于环境试验出现物理损坏（迁移、腐蚀、机械破坏、分层等）；有些物理损坏可能由供应商和用户同意认为仅仅是外观不良而不影响认证结果；
如果失效原因被供应商和用户认为是由于处理不当、测试板连接、ESD或其它跟测试条件无关的原因引起，这些失效可以被忽略，但应呈现在报告中 | | | | | | 5a HTOL1：最高允许工作温度条件下施加一定的驱动电流使得结温达到最高允许值
5b HTOL2：为最大驱动电流条件下选择工作温度使得结温达到最高允许值
无需降额时，5a=5b | | | | | | 6a WHTOL1：双85条件下施加一定的驱动电流使得结温达到最高允许值，30min开/30min关
6b WHTOL2：双85条件下施加最小驱动电流、如无最小电流则施加不使结温超3K的驱动电流 | | | | | 从完成H3TRB或HAST、TC试验的样品中，每项随机抽取2个样品 | 完成功率温度循环（PTC）/间歇工作寿命（IOL）、高温高湿工作（WHTOL1、WHTOL2）/高温高湿反偏（H3TRB）、硫化氢腐蚀（H2S）、混合气体腐蚀（FMG）试验的样品中随机抽取2只/批 | | JESD24-3（MOS），JESD24-4（BJT），JESD24-6（IGBT） | JESD51-50、JESD51-51、JESD51-52，针对LED |
AEC-Q101标准要求 | 高温工作High Temperature Forward Bias | | | | | | | | 1000 hours at the maximum forward bias,TEST before and after HTFB as a minimum. | | | | | | | | | | 1000 cycles(TA=minimum range of -55℃ to maximum rated junction temperature,not to exceed 150℃).Can reduce duration to 400 cycles using TA(max)=25℃ over part maximum rated junction temperature or using TA(max)=175℃ if the maximum rated junction temperature is above 150℃.TEST before and after TC | | 高温高湿High Temperature High Humidity Bias | | | | | | | | 1000 hours at TA=85℃/85%RH with part Forward biased.TEST before and after H3TRB as a minimum | | 功率温度循环Power and Temperature Cycle | | | | | | | | Perform PTC if △TJ≥100℃ can not be achieved with IOL. Tested per duration indicated for timing Requirements in Table 2A.Parts Powered and Chamber cycled to insure △TJ≥100℃(not to exceed absolute maximum ratings).
TEST before and after PTC as a minimum. | | DPA Destructive Physical Analysis | | | | | | | | Random sample of parts that have successfully completed H3TRB or HAST, and TC. | | | | | | | | | JESD24-3,24-4,24-6 as appropriate | Measure TR to assure specification compliance and provide process change comparison data. |
AEC-Q102标准要求 | 高温工作High Temperature Operating Life HTOL | | | | | | | Only for LED and Laser Component
Duration 1000 h at maximum Specified Tsolder,choose corresponding drive current according to derating curve to achieve max Tj defined in the part specification.Test 5a is equivalent to 5b if no derating.For use within specical application; a longer test duration my be needed to ensure reliability over aplication lifetime.For details,see Appendix 7a"Reliability Validation for LEDs"
Test before and after HTOL1 | | 高温工作High Temperature Operating Life HTOL | | | | | | | Only for LED and Laser Component
Duration 1000 h at maximum Specified drive current,Choose corresponding Tsolder according to derating curve to achieve max Tj defined in the part specification.Test 5b is equivalent to 5a if no derating.For use within specical application; a longer test duration my be needed to ensure reliability over aplication lifetime.For details,see Appendix 7a"Reliability Validation for LEDs"
Test before and after HTOL2 | | | | | | | | | PC before TC
Duration 1000 cycles.Minimum soak & dwell time 15 min.Minimum temperature as specified in part specification. Choose TC condition exceeding or equal to the operating temperature according to the apporopriate part specification:
TC condition 1:max Tsolder=85℃
TC condition 2:max Tsolder=100℃
TC condition 3:max Tsolder=110℃
TC condition 4:max Tsolder=125℃
TC condition and tranfer time shall be mentioned in the test report.
It is recommended to decapsulate the part after TC and perform WBP if applicable.Report data.The supplier has to provide explanation in case that WBP cannot be performed.
TEST before and after TC. | | 高温高湿Wet High Temperature Operating Life | | | | | | | Only for LED and Laser Component
PC before WHTOL1
Duration 1000 h at Tsolder=85℃/85%RH with drive current according to derating curve to achieve max Tj defined in the part specification.Operated with power cycle 30 min on /30 min off
Test before and after WHTOL1,DPA after WHTOL1 | | 高温高湿Wet High Temperature Operating Life | | | | | | | Only for LED and Laser Component
PC before WHTOL2
Duration 1000 h at Tsolder=85℃/85%RH with minimum drive current according to part specification.If no minimum rated drive current is specified, a drive current shall be chosen not to exceed a rise of 3K for Tjunction.
Test before and after WHTOL2,DPA after WHTOL2 | | 功率温度循环Power Temperature Cycling | | | | | | | Only for LED and Laser Component
PC before PTC
Duration 1000 temperature cycles with drive current according to derating curve to achieve max Tj specified in part specification.
Operated with power cycle 5 min on/ 5 min off.
Minimum temperature as specified in part specification. For maximum temperature choose:
PTC condition 1:max Tsolder=85℃
PTC condition 2:max Tsolder=105℃
PTC condition 3:max Tsolder=125℃
PTC condition should be chosen closest to the operating temperature range within the appropriate part specification. PTC condtion shall be mentioned in the test report. For use within special application; a longer test duration may be needed to ensure reliability over application liftime.For details.see Appendix 7a "Reliability Validation for LEDs"
TEST before and after PTC.DPA after PTC. | | DPA Destructive Physical Analysis | | | | | | | Random sample of parts that have successfully completed PTC/IOL.WHTOL/H3TRB,H2S,and FMG(2 samples each) | | | | | | | | JEDEC
JESD51-50
JESD51-51
JESD51-52 | Measure thermal resistance according to JESD51-50, JESD51-51,and JESD51-52 to assure specification compliance. |
华碧实验室已为数百家LED封装器件提供了AEC-Q102测试认证,通过执行大量的车规级测试案例，积累了丰富的认证试验经验，可以提供更专业、更可靠的测试服务，同时提供LED灯珠、Mini LED、光电二极管、晶体管、激光芯片、激光元件的环境试验和AEC-Q102认证服务，更有一流的LED材料表征与分析技术和LED失效分析技术，提供一站式LED行业解决方案，为LED行业的乘风破浪保驾护航。
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