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专家回复：pls go thorugh below website. http://www.nxp.com
专家回复：DFN2020 provide the higher power dissipation capability DFN1010 size is 1.0*1.0 DFN202 size is 2.0*2.0 DFN1006 size is 1.0*0.6
专家回复：the DFN1010 power dissipation capability is up to 1w
专家回复：whole the DFN2020 , DFN1010 and DFN1006 device alreday released in this market
专家回复：it depends on the design , for portable device , the DFN package is the trend in the future.
专家回复：the more pad size will help to dissipate the heat , the more pcb layers would aslo help to dissipate the heat
专家回复：yes , we provide the DFN1006 package for small signal switch application.
专家回复：since the end product "slim" and "light" design is the trend in the future , the compoenet is also become more and more smaller.
专家回复：NXP DFN package provide the solder side pad to get the higher solderability and easy checking the soldering quality.
专家回复：the thermal perfromacne is very important for such kind of device and design.
专家回复：NXP standard product provide the transistor , diode , mosfet and ESD protection device.
专家回复：It is popular used in portable deice application and get positive feedback.
专家回复：DFN package provide the smaller package with higher power density.Since the portable device , the slim design is the trend now. DFN package help designer to achieve the slim design.
专家回复：leadless , smaller package with higher power density is the trend in the future.
专家回复：NXP improvment the solder side pad let the robust soldering and easy chceking the soldering quality.
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