BGA制程工艺术语清单

发表于 2024-10-30 09:55

1. AABUS: As Agreed Upon Between User
and Supplier
由供需双方协商确定 2. ASIC: Applications Specific IC
专用集成电路 3. ASM: Array Surface Mount
阵列表面贴装4. ASMP: Application Specific Module Packaging
专用模块封装5. AXI: Automatic X-Ray Inspection
自动X射线检查6. BGA: Ball Grid Array
球栅阵列 7. BOC: Board-On-Chip
芯片上板子直装 8. BT: Bismaleimide-Triazine
双马来酰亚胺三嗪 9. CAGE: Commercial and Government Entity
商业及政府机构 10. CBGA: Ceramic Ball Grid Array
陶瓷球栅阵列

发表于 2024-10-30 09:56

11. CCGA: Ceramic Column Grid Array 陶瓷柱栅阵列12. CGA: Column Grid Array 柱栅阵列13. COB: Chip-On-Board 板上芯片直装14. CPU: Central Processing Unit 中央处理器15. CSP: Chip Scale Packages 芯片尺寸封装16. CTE: Coefficient of Thermal Expansion 热膨胀系数17. CTF: Critical To Function 关键功能 18. DBDPE: Decabromodiphenyl Ether 十溴联苯醚19.DDR-SDRAM：Double-Data-Rate Synchronous Dynamic Random Access Memory 双倍速率同步动态随机存取存储器20.Df: Dissipation Factor 损耗因子

发表于 2024-10-30 09:57

21.DfM: Design for Manufacturability 可制造性设计22.DfR: Design for Reliability 可靠性设计23. DIG: Direct Immersion Gold 直接浸金24. Dk: Dielectric Constant 介电常数25. DMA: Dynamic Mechanical Analysis 动态力学分析26. DSBGA: Die-Size Ball Grid Array 芯片尺寸球栅阵列27. DSC: Differential Scanning Calorimetry 差分扫描热量测定法28. DSP: Die Size Package 芯片尺寸封装29. dT: Temperature Differential 温差30. ECM: Electrochemical Migration Test 电化学迁移测试

发表于 2024-10-30 09:57

31. ENEPIG: Electroless Nickel/Electroless Palladium/Immersion Gold 化学镀镍/化学镀钯/浸金32. ENIG: Electroless Nickel Immersion Gold 化学镀镍浸金33. ESD: Electrostatic Discharge/ Electrostatic Device 静电放电/静电装置34. ESS：Environmental Stress Screening 环境应力筛选35. EU: European Union 欧盟36. FAT: Flux Activation Time 助焊剂活化时间37. FBGA: Fine Pitch Ball Grid Array 密节距球栅阵列38. FC: Flip Chip 倒装芯片39. FPT: Fine Pitch Technology 密节距技术40. FRBGA: Fine-Pitch, Rectangular Ball Grid Array 密节距,矩形球栅阵列

发表于 2024-10-30 09:57

41. FT: Functional Test 功能测试42. GAC: Grid Array Component 格栅阵列器件43. HASL: Hot Air Solder Level 热风焊料整平44. HAST: Highly Accelerated Stress Testing 高加速应力测试45. HCI: Hydrochloric 氯化氢的46. HDB: High Density Printed Boards 高密度印制板47. HF: Hydrofluoric 氢氟酸的48. HoP: Head-on-Pillow 枕头效应49. I/O: Input/Output 输入/输出50. ICT: In-Circuit Test 在线测试

发表于 2024-10-30 09:58

51. ILC: Independent Loading Mechanism 独立加载机构52. IMC: Intermetallic Compound 金属间化合物 53. IR: Infrared 红外线54. LCP: Liquid Crystal Polymer 液晶聚合物55. LFBGA: Low-Profile Fine-Pitch Ball Grid Array 小外形密节距球栅阵列56. LMC: Least Material Condition 最小实体条件57. LTD: Liquidus Time Delay 液相时间延迟58. MCM: Multichip Module 多芯片模块59. MCM-L: Multichip Module-Laminate 多芯片模块-层压板60. MCP: Multichip Package 多芯片封装

发表于 2024-10-30 09:58

61. MD: Metal Defined 金属限定62. MDA: Manufacturing Defect Analyzer 制造缺陷分析仪63. MDS: Multi Device Subassembly 多器件子组件64. MLC: Multilayer Ceramic 多层陶瓷65. MMB: Moisture Membrane Bag 湿薄膜袋66. MMC: Maximum Material Condition 最大实体条件67. NAND: Not “And” 非“与” 68.NSMD: Nonsolder Mask Defined 非阻焊膜限定69. OEM: Original Equipment Manufacturer 原始设备制造商70. OSP: Organic Solderability Preservative 有机可焊性保护剂

发表于 2024-10-30 09:58

71. PBB: Polybrominated Biphenyl 多溴化联苯72. PBBO: Polybrominated Biphenyl Oxide 多溴化联苯氧化物73. PBDE: Polybrominated Diphenyl Ether 多溴二苯醚 74. PBGA: Plastic Ball Grid Array 塑封球栅阵列75. PCA: Printed Circuit Assembly 印制电路组件76. PCB: Printed Circuit Board 印制电路板77. PCM: Phase Change Materials 相变材料78. PCMCIA: Personal Computer Memory Card International Association 个人计算机存储卡国际协会79. PGA: Pin Grid Array 针栅阵列80. PLCC: Plastic Leaded Chip Carrier 塑料有引线芯片载体

发表于 2024-10-30 09:59

81. PSA: Pressure Sensitive Adhesives 压敏粘合剂82. PTH: Plated Through-Hole 镀通孔83. QFP: Quad Flat Pack 方形扁平封装84. RDS: Rectangular Die Size 矩形芯片尺寸85. RF: Radio Frequency 射频86. RFID: Radio Frequency Identification 射频识别87. RMS: Root Mean, Square 均方根88. RoHS: Restriction of Hazardous Substances 有害物质限制89. RSS: Ramp-Soak-Spike 升温-保温-峰值90. RTS: Ramp-to-Spike 升温至峰值

发表于 2024-10-30 09:59

91. SAC: Sn/Ag/Cu 锡/银/铜 92. SDRAM: Synchronous Dynamic Random Access Memory 同步动态随机访问存储器 93. SGA: Solder Grid Array 焊料栅格阵列94. SIR: Surface Insulation Resistance 表面绝缘电阻95. SMD: Solder Mask Defined 阻焊膜限定96. SMOBC: Solder Mask Over Bare Copper 裸铜覆阻焊膜97. SMT: Surface Mounting Technology 表面贴装技术98. SO-DIMM: Small Outline Dual In-Line Memory Module 小外形双列直插存储模块99. SOIC: Small Outline Integrated Circuit 小外形集成电路100. SPC: Statistical Process Control 统计过程控制

[PCB] BGA制程工艺术语清单

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