这里好冷啊，我决定每天都来踩一脚

只看该作者 · 2011-3-10 10:13

每天读一下EETimes的头版，简单翻译一下，英语水平比较烂，看能**多久，从今天开始！

只看该作者 · 2011-3-10 18:04

Google demos tablet version of Android
Rick Merritt
3/9/2011 6:44 PM EST
SAN MATEO, Calif. – Two Google developers demonstrated Android 3.0, the first version of the open source mobile operating system supporting tablets. The so-called Honeycomb release is also the first version to support hardware acceleration and multicore processors.
两个google的工程师展示了Android3.0，第一个支持平板电脑的开源移动操作系统。这个称为Honeycomb的版本首次支持了硬件加速器和多核。
Google has yet to announce a general release date for the Honeycomb source code. Last week, Motorola launched its Xoom tablet using the OS, running several applications developed in tandem with the systems software.
Google还没有发布这个源码，上周，Motorola在它的Xoom平板电脑上启动了这个系统，运行了一些应用程序。
"Honeycomb is all about the tablet, but along the way we made a lot of general improvements in the user interface," adding new rendering and animation engines, said Chet Haase, a Google UI developer who showed the software to an audience of more than 400 at the Android Developer Conference here.
Honeycomb都是围绕平板电脑在做，不过一路上对用户界面做了很多的改进，
A version of the software geared for smartphones is still in the works with no public release date given. It could emerge as early as May at the annual Google I/O event.
一个面向智能手机的版本还在筹备阶段尚未发布，预计最早在5月份的时候出来。
Honeycomb uses the OpenGL applications programming interface for 2-D graphics, video acceleration and a new 3-D engine from Google called Renderscript. In a video here, Google developer Romain Guy demonstrated the engine running a fully hardware accelerated browser, a YouTube video wall, music and e-book apps.
Honeycomb 使用2D图像，video加速，3D引擎的OpenGL应用程序接口，Google称作Renderscript. 在一个视频录像里工程师展示了一个全硬件加速浏览器，YouTube电视墙，音乐和电子书应用。
Renderscript has been in the works for three years, uses the C99 language and can be used both for graphics and compute jobs. The software can automate the work of using multiple cores in a host processor without requiring developers to generate threads. A future version will let compute jobs be split among graphics and host processors, probably using the OpenCL API.
"We added a lot of hardware acceleration with this release," said Guy. "We used GPUs before, but we weren’t really taking advantage of them across the interface," he said.
Renderscript 准备了三年，使用C99，可用于制图和计算，
Renderscript supports vectors, timed behaviors for animations and some of the features of graphics shading languages. It does not allow memory allocations. All data set up is handled in Javascript prior to rendering.
Honeycomb comes with hardware acceleration turned off by default. Developers can enable the feature globally or turn it on or off in selected areas of their apps. Motorola chose to enable hardware acceleration throughout its Xoom tablet.
Honeycomb supports USB keyboards, a first for Android. Work is going on to support other USB devices. The Android OS which originally supported just 40 Mbytes main memory, now supports up to a Gbyte.
A new animation framework lets developers animate any object or property. Haase and Guy demonstrated the animation framework in a video here.
Honeycomb does away with hardware navigation buttons given users are expected to flip tablets regularly between landscape and portrait modes. Instead it uses a system bar always present at the bottom of the screen but sometimes toned down in a "LightsOut" mode in apps such as an e-book reader.
The OS also does away with menus, using a so-called action bar at the top of the screen to navigate through applications. Developers have full control of the look and feel of the action bar.
About two dozen OEMs now ship more than 150 Android devices that ride on more than 150 carrier networks in nearly 100 countries. The devices have access to a library of more than 150,000 apps, and each day about 300,000 Android devices are activated for the first time, said Haase

只看该作者 · 2011-3-11 19:06

Atmel rolls cypto authentication device
3/3/2011 1:51 PM EST
SAN FRANCISCO—Atmel Corp. Thursday (March 3) announced an ultra low power cryptographic authentication device with enhanced hardware security features and increased flexibility.
According to Atmel (San Jose, Calif.), the Atmel ATSHA204 is the first turnkey, optimized authentication device to include a 4.5Kbit EEPROM and a hardware SHA-256 accelerator. The device is suited for industrial, consumer, energy metering, home automation, computing and medical applications, according to the company.
Atmel announced the new product, as well as a family of digital temperature sensors and a new suite of microcontroller development tools at the Embedded World 2011 Exhibition in Nuremberg, Germany.
"Atmel is committed to offering easy-to-use crypto products that incorporate the latest NIST cryptographic algorithms for the highest level of trust," said Kerry Maletsky, Atmel's director of crypto products, in a statement. "These products fill the void for secure storage needs missing in most microcontroller and ASIC solutions for component authenticity, firmware integrity checks, secure storage of proprietary and confidential data storage, and so on."
The ATSHA204 includes optimized hardware security features designed to authenticate objects, control the OEM supply chain, prevent piracy of software or other intellectual property, and protect sensitive data, according to Atmel. The device features 256-key encryption, which makes it larger than any other authentication device on the market, according to the company.
The ATSHA204 is available now in industry-standard SOT-3, SOIC-8, UDFN-8 and TSSOP-8 packages with either a single-wire or I2C interface, Atmel said. Pricing starts at 41 cents per unit in 1,000-unit quantities, the company said.
Also Thursday (March 3), Atmel introduced what it called the world's first family of high-precision digital temperature sensors with both integrated nonvolatile registers and integrated Serial EEPROM memory. The Atmel AT30TS750 family is suired for consumer, industrial, computer and medical applications, the company said.
On Wednesday, Atmel launched a new fully integrated platform of development tools for of its 8- and 32-bit AVR embedded microcontrollers. Atmel AVR Studio 5 is an enhanced version of Atmel's integrated development environment, with support for all 8- and 32-bit AVR MCUs, the company said.

＝＝＝＝＝＝＝＝＝＝＝＝＝＝＝＝＝＝＝＝＝＝＝＝＝＝＝＝＝＝＝＝＝＝＝＝＝＝＝＝＝＝＝
SAN FRANCISCO—Atmel公司星期四(3月3日)宣布了一款超低功耗的加密认证器件，其具有强大的硬件加密特性和很好的兼容性。
据Atmel(San Jose, Calif.)介绍，ATSHA204是第一款turnkey，最优化的认证器件，含有4.5Kbit的EEPROM和硬件SHA-256加密装置。适用于工业，消费电子，电能，家庭自动化，计算和医疗设备等各个领域。
Atmel在德国纽伦堡举行的2011年嵌入式领域展览会上展示了这个新产品，同时还有一系列的数字温度传感器和一套微控制器开发工具。
Atmel加密产品总监Kerry Maletsky在一个声明中指出：Atmel致力于提供方便易用的加密产品，纳入了最新的美国国家标准关于最高安全级别的加密算法。这些产品填补了安全存储需求方面的空白，包括大部分微控制器和认证部件专用IC，固件完整性检查，专利安全存储，私密资料存储等等多个领域。
ATSHA204包含最佳化的硬件安全特性旨在认证目标对象，控制OEM供应链，防止软件盗版或者是其他知识产权，保护敏感数据。256key的加密技术特性使得它会比市场上的其他认证器件要大。
该公司称，ATSHA204产品现在存量有SOT-3,SOIC-8,UDFN-8和TSSOP-8封装，可通过单总线或者I2C总线来访问，1000单位量的起价在每片41美分。
在星期四(3月3日)，Atmel同时介绍了一款它称为世界上首个系列的高密度数字温度传感器，集成了非易失性的寄存器和串行EEPROM存储器，AT30TS750系列适合用于消费电子，工业，计算机，医疗设备应用。
该公司星期四称，Atmel新启用了一套完全整合了8位和32位AVR的开发平台工具，Atmel AVR Studio 5是一套增强版的开发环境，支持所有的8位和32位AVR控制器。

只看该作者 · 2011-3-12 23:32

Calxeda gives a peek into its ARM server SoC
Rick Merritt
3/11/2011 2:34 PM EST
SAN JOSE, Calif. -- Startup Calxeda (Austin) has released a few details about its unannounced ARM-based processor aimed at low power servers.

Calxeda's initial reference design will be based on a quad-core Cortex A9 SoC that consumes 5W including associated DRAM. The chip includes a fabric that acts as an interconnect to other processors, enabling OEMs to pack as many as 120 SoCs in a 2U-sized chassis.

The chip aims to deliver a 5-10x performance advantage and a 15-20x price/performance advantage over traditional server processors. Calxeda also downplayed frequency as a measure of performance, suggesting the chip will run at a relatively low clock rate.

The company said it "will be open for proof of concept proposals this fall," but did not say when it will sample its chips. The startup is behind at least two other companies addressing the market for low power processors, chiefly aimed at large data centers.

Marvell's Armada XL is a 1.6 GHz quad-core Cortex SoC consuming up to 10W and already in test systems at top tier data center customers. Startup Tilera's 64-core, 32-bit processor using a custom architecture not based on ARM is currently shipping, and the company has promised a 100-core, 64-bit version for later this year.

A growing group of data centers, OEMs and chip makers have expressed interest in using non-x86 processors to lower server power. The x86 camp has responded to the trend, too.

Startup SeaMicro recently updated its server using 512 Intel's Atom CPUs to a new version of the chip. Intel itself has designed streamlined x86 boards to act as low power server nodes and is expected to announce news about its so-called micro-server efforts next week.

One sever maker recently debuted a system using a dual-core ARM chip from STMicroelectronics.

ARM rolled out its A15 core last fall with enhanced memory support for servers and networking gear. However, the company has not described plans for a 64-bit core yet.

来不及翻译了，好像是说要做个片上系统，四核cortexA9的功耗能做到5W的功耗，可以做到在很低的频率下工作，概念设计会在秋季提出来，但是还没有提出样片提供的时间。

只看该作者 · 2011-3-13 21:22

LTE: The road ahead
Cristiano Amon, Qualcomm
3/4/2011 3:00 PM EST
2010 was an exciting year for broadband wireless technologies, particularly LTE.  Over 64 operators have committed to supporting LTE in 31 countries and there are 17 LTE networks in operation today.

Significant progress has been made in deploying LTE, but there are still enhancements and innovations needed to help network carriers give their customers a ubiquitous, high quality experience on their LTE-enabled devices no matter where they use them.  These enhancements and innovations will not only be beneficial to today’s LTE networks, they are also necessary for LTE to reach the next step in its evolution, such as LTE Advanced.

There are a variety of issues that need to be addressed so network operators and handset OEMs can take full advantage of the performance benefits of LTE both now and in the future.  Three issues of particular concern are multi-mode/multi-frequency support, implementing voice over LTE and how networks will handle interference.

First, let’s consider the different ways LTE is being implemented globally and how this will effect device OEMs looking to support the LTE standard.  The radio frequencies used on LTE networks vary from region to region; there are currently over 20 different frequencies ranging from 700 MHz to 2.6 GHz that can be used by LTE networks around the world.

In order to ensure that LTE supports global roaming and realizes the scale of a global technology, LTE smart phone and data card OEMs will need access to chipsets with multi-band, multi-mode radios.  These same chipsets must also be backward compatible with existing 3G technologies to provide a comparable experience in areas without LTE coverage or ubiquitous 3G.  Supporting multiple technologies and frequency bands in a single chipset is hard enough, but making the chipset small enough and making sure the chipset has the right power management capabilities to provide all day operation is a challenge that few mobile chipset providers are prepared to meet.

Another issue to be addressed is LTE support for voice.  Today’s LTE networks support data traffic only; smartphones can use LTE for data traffic, but must fall back on 3G technologies to provide simultaneous voice-and-data or voice-only connections. LTE Release 9 contains enhancements that will minimize the transition time from an LTE data session to a 3G voice call.  Native voice support in future LTE networks will be provided using VoIP.  To handle the stringent quality and coverage expectations of voice, LTE VoIP networks can seamlessly handover to 3G using the single radio voice call continuity feature (SRVCC).

One key advantage of the 3G fallback and voice continuity features of LTE is that they enable the support of tight voice interworking between LTE and 3G in a fully integrated “single radio” chipset.  These single radio approaches to voice interworking will maximize the LTE user experience, reduce smart phone cost and extend battery life.

As data usage on mobile networks continues to become increasingly popular, LTE networks will also require the use of more cells with smaller coverage area per cell in order to handle the expected traffic load.But increasing the number of cells in a coverage area presents another problem:  interference.  Future releases of the LTE standard, specifically Release 10 (also called LTE Advanced) have been specifically designed to address the interference issue through the use of advanced network topologies and by leveraging a wider bandwidth frequency spectrum.

Existing WAN cell coverage can be augmented to handle LTE data traffic growth.  Picocells (small base stations with a range of up to 1 km that integrate with the existing macro network) and femtocells (indoor cellular access points with a 10 meter range similar in size, price and range to WiFi access points that are connected to the carrier’s network via the user’s IP network) help augment the existing cell network by using spatial diversity to enhance network capacity and coverage.  From a network topology standpoint, future versions of LTE (Release 9) and LTE Advanced have been designed to integrate support for these carrier-deployed picocells and/or user-deployed femtocells. LTE will also support signal relays and repeaters to further improve LTE network coverage and capacity. This mix of existing macrocells with lower power nodes, like picocells and femtocells, create heterogeneous networks (HetNets) that bring the network closer to the user.
However, the addition of more cells to the network creates new cell edges, and users at those edges may experience reduced performance due to radio interference between cells.  This situation has been accounted for in the LTE Advanced standard which incorporates several advanced interference management features to maintain network performance on the cell edge.  For example, LTE Advanced’s support for intelligent node and adaptive resource allocation will extend network range and improve network capacity by ensuring fairness of service to users by providing data rates that are proportional to their respective signal qualities and mitigating signal interference between cells.
LTE Advanced can utilize a wider frequency spectrum (20 MHz to 100 MHz) through the use of carrier aggregation.  Also known as multicarrier, carrier aggregation allows carriers to send and receive data over an aggregated date pipeline to increase data rates and to lower latency.  This means that carriers will be able to support high-speed data traffic even in times of peak network usage.
When used in conjunction with the advanced network topology technologies mentioned above, carrier aggregation will efficiently handle any interference and capacity issues presented by the use of HetNets.

All of this would seem to make the evolution from LTE to LTE Advanced networks a daunting task; one that requires the tightly-knit cooperation of network carriers, device OEMs and mobile chipset vendors around the world.  But much work has already been done on the development of LTE Advanced, and the standard is set to be ratified in the first quarter of this year.  LTE Advanced will require some infrastructure development in order to build HetNets, but the picocells and femtocells used to do this are low-cost solutions that will help minimize capital expenditures.  In fact, outside of deploying picocells and femtocells, much of the work needed to upgrade LTE networks to LTE Advanced will happen at the software level.

Technology trials of LTE Advanced have already delivered compelling results.  LTE Advanced, like LTE, will enable mobility with 3G network technologies to ensure a seamless user experience for consumers as they move between 3G and 4G networks.  LTE Advanced is well on its way to becoming a fully commercial standard, and the high-speed data rates it provides will play an instrumental role in the ongoing evolution of mobile communications and computing.

Cristiano Amon is Senior Vice President of Product Management at Qualcomm CDMA Technologies, Inc.

2010年在宽频无线技术上是个非常令人兴奋的一年，尤其是LTE技术，超过64个经营者来自31个国家和地区致力于LTE的研究，有17种LTE网络正在运营。LTE技术有了很重要的进步，但是，仍然有很大的发展和创新的空间，令网络使用者无论身在何处都能通过LTE网络获得高质量的通信体验。这些改进方向不仅有益于今天的LTE网络，而且是诸如高级LTE等下一代网络的发展方向。
现在仍有许多问题需要解决，才能让LTE供应商和手机OEM制造商充分利用这个网络。三个主要的问题是：允许多态/复频，声音传输，如何处理干扰问题。
首先，我们讨论一下世界上LTE不同的实施方案以及这些方案将怎样影响设备OEM支持LTE标准。无线电频率用于LTE网络将不同于区域到区域之间，世界上有20种不同的频率介于700MHz到2.6GHz之间可以用于LTE网络。
为了保证LTE能够满足全球漫游并达到全球技术的规模，LTE智能电话和数据卡制造商需要通过多态/复频的方式访问芯片组。同时这些芯片组需要向后兼容3G技术，以提供一种兼容的方法来适应在没有LTE网络覆盖的地区。在单个芯片组里实现多种技术和频段已是相当复杂，而需要将这个芯片组做得足够小，并且做到恰到好处的电源管理使得其能提供整天的操作更是具有非常大的挑战性，几乎没有移动芯片提供商有能力做到。
另一个需要解决的问题是声音的支持。目前LTE网络仅能提供数据通信，智能电话能通过LTE进行数据通信，但是需要依赖于3G技术来实现声音和数据同时传播或者只有声音的连接。LTE发布了9 contains 增强版，缩短了一个LTE数据会议跟3G有声电话之间的传送时间，Native voice，，，，，为了解决严格的声音质量和覆盖期望，LTE VoIP 网络，，，，这个的关键

只看该作者 · 2011-3-14 21:40

Wireless LAN market reached record level in 2010
Jean-Pierre Joosting
3/13/2011 4:44 PM EDT
A recently published report by Dell'Oro Group reveals that the worldwide Wireless LAN (WLAN) market achieved a record high in 2010 as revenues grew 25 percent to surpass $5 billion.

The report also shows that the small office, home office (SOHO) segment surpassed $3 billion, while the Enterprise WLAN segment grew at its fastest rate since 2006 to exceed $2 billion in 2010.

"The enterprise WLAN segment has now seen seven straight quarters of revenue growth, having pushed its way over the $500 million mark for the first time in the third quarter of 2010, and then over the $600 million mark in the fourth quarter," stated Loren Shalinsky, Senior Analyst of Wireless LAN research at Dell'Oro Group.

"Enterprise WLAN vendors recognized continued strength from the education and healthcare vertical segments, but also saw a corresponding rise from their general enterprise sales as well. We believe this to be another sign of the continued importance of wireless LAN to companies' networking infrastructures, and of a worldwide economy that is on the upswing. Almost all enterprise WLAN vendors had at least modest quarterly revenue gains in the fourth quarter, but Alcatel-Lucent, Cisco, and Aruba each posted quarterly revenue gains of more than 10 percent," added Shalinsky.

According to the report, the following vendors each posted full-year 2010 WLAN revenue growth that exceeded 40 percent: Alcatel-Lucent, Aruba, Belkin, NETGEAR, Tropos, and ZyXEL.

无线网的市场创造了一个新纪录。最近好多新闻都是在讲无线网络。

只看该作者 · 2011-3-15 23:06

NAND flash prices soar on supply fears
Peter Clarke
3/14/2011 11:21 AM EDT

LONDON – The spot price for NAND flash memories jumped by up to 20 percent on Monday (March 14) on fears that supplies could be limited in the aftermath of the earthquake that struck northern Japan on Friday (March 11).

Spot prices jumped on Monday between about 10 and 20 percent, according to the Dramexchange service provided by TrendForce Corp.

Toshiba, the leading maker of NAND flash memory, announced Monday (March 14) that it would close down manufacturing and business sites in response to a request from the Tokyo Electricity and Power Company. However as Toshiba's Yokkaichi fabs are a considerable distance south of Tokyo and even further from the parts of the country worst-affected by the earthquake it is not clear whether these plants will be affected by shutdowns.

In the DRAM spot market most suppliers stopped offering chips due to the uncertainty over the impact of the Japan earthquake. As a result the overall price rose more than 5 percent from early day trading.

While supplies could be constrained, particularly as some fabs may be subject to loss of electricity, so could demand at Japanese consumer electronics companies that use memory chips. As such the dynamic effect on supply and demand is not yet clear, although with so much equipment manufacturing now in China the overall effect is expected to see supply fall behind demand.

因为担心日本本部地震带来的供应紧张，NAND Flash现货价格飞涨20％.
现货价格星期一涨了10％－20％。东芝星期一宣布应电力公司的请求，将会关闭制造工厂和商业网站，不过，东芝的Yokkaichi厂在东京南边相当远的地方，离那些受地震灾害最严重的地区更远。不清楚是否会受到关闭的影响。
而DRAM现货市场很多供应商都停止了供应，所以全部价格都起码涨了5％。
供应可以节制，制造厂可以应电力短缺而关闭，可以约束日本储存的消费需求，这样的动态影响供求尚不明朗，尽管有很多制造在中国，整体的效果要看后续的需求情况。

只看该作者 · 2011-3-16 22:41

OCZ buys SSD controller firm
Mark LaPedus
3/15/2011 12:49 PM EDT
SAN JOSE, Calif. - OCZ Technology Group Inc., a provider of solid-state drives (SSDs), has signed a definitive agreement to acquire Indilinx Co. Ltd, a privately-held fabless provider of flash controller silicon and software for SSDs.

Under the terms, OCZ will acquire Indilinx for approximately $32 million in stock.

Indilinx is headquartered in South Korea and currently sells its line of flash controllers to SSD manufacturers. Indilinx controllers have been deployed within OCZ's SSD products since December of 2008, and are currently featured in the Z-Drive series of PCIe-based SSDs.

The acquisition is expected to extend OCZ's capabilities with advanced controller technology including Tinkerbell, a high performance eMMC 4.4 x controller that replaces SSDs in consumer electronic devices such as smartphones, tablet PCs, GPS units, and netbooks.

Following its acquisition by OCZ, Indilinx will continue to produce and supply its line of controller products to SSD manufacturers and OEMs on a global basis. The Indilinx controller business, and its 45 employees, will remain intact under the leadership of Bumsoo Kim, the founder and president of Indilinx, and Hyunmo Chung, Indilinx's chief technology officer.

OCZ will continue its own R&D program to develop new proprietary technologies and products to expand its own solid state drive offerings. The Indilinx acquisition notwithstanding, OCZ plans to continue utilizing controllers from other manufacturers, including long-term partner SandForce Inc.

OCZ recently reported its third quarter 2011 results, which ended on Nov. 30, 2010. Net revenues in Q3 were a record $53.2 million, and increased 40 percent both on a year-over-year and sequential basis, from $38.0 million reported in Q3'10 and in Q2'11.

GAAP net loss for Q3'11 was $8.3 million, or $0.29 loss per diluted share. This compares to GAAP net loss of $1.0 million, or $0.05 loss per share in Q3'10.

It expects to report record revenue for its fiscal 2011 fourth quarter of approximately $64 million, an increase of nearly 100 percent from the $32.4 million reported in last year's fourth quarter. For the year ended February 28, 2011, revenues are expected to be approximately $189 million compared to $144 million in fiscal 2010.

San Jose-based OCZ recently announced it is the first SSD manufacturer to complete the transition to 2x-nm NAND flash-based storage solutions. OCZ also recently rolled out its next generation Vertex 3 SATA III SSD product family, a lineup that caters to both client and enterprise applications. Harnessing the 6Gbps speed of the SATA III interface, the new series delivers double the performance of the previous generation.

The Vertex 3 is the first solution to feature the new SandForce SF-2200 SSD processor, and raises the bar in performance with up to 550MB/s read and 500MB/s write transfer rates and up to 60,000 IOPS (4k random write).

Seeking to propel SSD drives into more of a mainstream product, SandForce recently rolled out its latest controllers in the arena. SandForce is one of several companies chasing after the emerging SSD merchant controller market. Indilinx, Jmicron, Marvell and others are also in the game. Several SSD players make their own controllers, including Samsung, SanDisk, Toshiba, Intel and Micron. Intel and Marvell reportedly have collaborated on an SSD controller, sources said.

OCZ公司，一个SSD供应商，签署了一份协议收购Indilinx公司，一个闪存供应商和SSD软件提供私有公司。
OCZ大约收购了Indilinx公司3200万美元股票。
Indilinx总部在韩国，目前向SSD制造商销售闪存控制器。自2008年12月份以来，Indilinx控制器已经部署在OCZ的SSD产品，目前正在推出一系列基于PCIede SSD的Z驱动器。
此次收购行动是OCZ扩展起高级控制器的能力，包括Tinkerbell，取代SSD的高性能eMMC 4.4倍控制器。
被收购之后，Indilinx将继续向SSD制造商和全球OEM厂商生产和供应其线性控制器，，，，
OCZ将继续自己的研发计划，开发新的专利技术和产品，以拓展自己的SSD供应能力，，
OCZ最近报道了第三季度的成果，，，，

只看该作者 · 2011-3-17 14:54

真是敬佩楼主:D

只看该作者 · 2011-3-17 23:38

9# jancey
呵呵，其实最难的是第四天到第七天，老想放弃，过了这几天就有点习惯的感觉了。不那么像背着负累了。每天也就一点时间而已，对英语不抱任何美好的憧憬，一步一步多用点就是了。:D

只看该作者 · 2011-3-17 23:39

Samsung rolls 'reinvented' 3-D monitor line
Mark LaPedus
3/16/2011 12:54 PM EDT
SAN JOSE, Calif. - Samsung Electronics America Inc., a subsidiary of Samsung Electronics Co. Ltd., has launch of two new HDTV monitors that incorporate its 3-D, Smart Hub and ConnectShare technologies.

The monitors include the Series 9 (TA950) and Series 7 (TA750) displays. Since launching the world’s first 120-Hz 3-D monitor in 2009, Samsung said it has ''reinvented'' the 3-D monitor experience to provide more picture quality and access to a wider array of content options.

The TA950 and TA750 displays incorporate Samsung’s 3D HyperReal Engine–which is said to optimize color, motion and contrast for ''hyper-realistic'' 3D viewing. Combined with a full HD 1920 x 1080 resolution and a refresh rate (120-Hz in the 3D mode), the TA950 and TA750 displays are ideal for 3-D PC or console gaming or for watching 3-D video content like movies and sports.

Both the TA950 and TA750 feature a built-in sync emitter that work seamlessly with the pair of 3-D active-shutter glasses that come bundled with each monitor. The new displays also feature two built-in 7-watt speakers.

Both models include Samsung’s ConnectShare feature which allows users to connect devices via USB to ''enjoy'' instant playback of video, music and photo files without connecting to a PC. Multiple input ports—including two HDMI inputs—allow users to connect up to seven electronic devices to the monitor, while a built-in HDTV tuner can further expand content choices to include live television.

The TA950 and TA750 models offer Samsung’s new Smart Hub, which includes:

•Search All, which makes it easier to search for and access desired content, not only on a PC, but across the Internet and on any connected storage, PC or mobile device within the home network.

•Your Video, which delivers video recommendations based on a user’s viewing history.

•Samsung Apps, the world’s first HDTV-based application store, which offers a range of paid and free apps that help people connect to their various passions – whether in sports, entertainment, information, games or social networking.

The TA950and TA750 monitors are available in 23- and 27-in. sizes. The TA950 and TA750 displays will be available as soon as May 2011, starting at $599.99.

三星电子的子公司三星美国公司发布了两款HDTV控制器，结合了3D，智能集线器和ConnectShare 技术。
该控制器包括9系列(TA950)和7系列(TA750)，自从2009年发布了世界第一款120Hz 3D控制器以后，三星表示它将再造3D控制器，以提供更好的画面质量和接入更多的内容阵列。
TA950和TA750结合了三星的3D HyperReal引擎，一个被称为最优化颜色和对比度的3D视觉效果。结合了全HD 1920 x 1080分辨率和刷新率(3D模式下120Hz)，TA750和TA950完美显示三维电脑或控制台游戏或者观看三维视频内容,比如电影和运动。
TA750和TA950内置了同步发射器，可与3D活动门无缝协同工作，新的屏幕显示有两个独特的7W内置扬声器。
两个模型都包括三星的ConnectShare功能,该功能允许用户通过USB连接装置“享受”即时播放视频,音乐和图片文件，即使没有连接到电脑。包含两个HDMI输入口，允许用户连接七个电子设备到控制器,而一个内置的高清晰度电视调谐器可以进一步扩大到包括电视直播内容的选择。
包括了：
搜索所有节目,这使得它更容易寻找和访问所需的内容,不仅仅是在PC,但通过因特网和连接存储、PC或移动设备。
你自己的视频,根据用户的浏览历史传递视频的建议.
三星的应用程序,这是世界上第一家HDTV应用库,它提供了一系列免费或者付费的应用软件，帮助客户联系他们的激情，无论是在运动，娱乐，信息，游戏还是社交网络。
适用于23和27寸屏幕，最快在2011年5月出来，599.99美元起价。

只看该作者 · 2011-3-18 23:05

Spending on wireless-enabled sensors grew more than 80 percent in 2010, says ABI
Julien Happich
3/6/2011 5:03 PM EST
Wireless sensors are bringing greater control and energy efficiency to the Building Automation Systems (BAS) market with adoption growing during the second half of 2010. Concerns over energy efficiency have long driven interest in new technologies to better manage energy use, and are driving interest and investment in wireless-enabled building environment controls.

2010年下半年，伴随着无线传感器越来越多的应用，为BAS市场带来了更高的控制和能源效率。对能源效率的忧虑一直以来推动着新技术的发展，以便能更好的管理和使用能源，并正在推动和投资无线楼宇环境的控制。

A mature market already, Building Automation Systems grew only slightly during 2010 but spending on wireless-enabled sensors grew more than 80 percent year-on-year. While that growth came from a wireless penetration in the commercial building control device market of less than 2 percent, by 2016, wireless sensors will represent 8 percent of the commercial buildings controls market at a market value of more than $110 million. These forecasts are contained in a new market data study from ABI Research.

一个成熟的市场已经形成，楼宇自动化系统在2010仅有些小的发展，但是在无线传感器件方面的花费增长已经比去年同期超过了80%，虽然这个增长来源于商业大厦控制市场的无线渗透不到2%，到2016年，无线传感器在商业大厦控制上将有8%的市场份额，超过1.1亿美元，这些预测数据来源于ABI对新市场数据的研究报告里。

"Heating Ventilation and Air Conditioning represent the key market and opportunity for wireless building automation sensors and controls, but the technology will push to replace wired systems across a range of applications including fire and safety, lighting, and access control," says principal analyst Jonathan Collins.
Wireless controls will not only replace traditionally wired controls especially in retrofit deployments, they will also expand the reach and control of building automation systems through the ability to use wireless sensors to monitor and control a range of new building environment functions. These include room occupancy, or lighting levels that take account of the amount of natural light available at any given time.
"The greater reach of the BAS enabled by wireless sensors and controls is also creating a shift in the balance between core revenue streams within the BAS market," adds practice director Sam Lucero. "Despite the uptake of additional sensors to monitor a growing list of applications, total BAS contract spending will skew increasingly toward software and services and away from hardware. The value and complexity within a BAS will reside in the distributed control and management of the system."

“热通风和空调将是这个市场的关键所在和主要机会，但这也将推动整个有线系统的更换，包括消防，照明和权限控制。”首席分析师onathan Collins说。
无线控制将不仅仅是取代传统的控制系统，尤其不仅仅是一种改良。它将通过无线传感器监控一系列的新大厦的环境功能，来扩大楼宇自动化系统的可控范围，包括房间使用情况，在任何时间根据自然光的情况确定照明亮度。
BAS无线传感控制较大的可控范围同时也带来了市场主要收入来源之间的平衡转变，业务主管Sam Lucero接着说，

ABI Research's "Commercial Building Automation" market data study provides shipment and revenue figures and forecasts for three key segments (hardware, software, and services) global building automation system (BAS) market for commercial buildings, from 2008 through 2016.
Visit ABI Research at http://www.abiresearch.com.

ABI研究的“商业建筑自动化”市场数据提供了BAS市场从2008到2016年的三个关键方面(硬件，软件和服务)的出货量及收入的图表和数据，参看网址，ABI研究报告。

只看该作者 · 2011-3-20 22:14

Chinese startup Brite takes broad ARM license
Peter Clarke
3/20/2011 7:11 AM EDT

LONDON – Brite Semiconductor Corp., a fabless chip company and design house founded in 2008, has said it has licensed a broad portfolio of intellectual processor cores from ARM Holdings plc, including Cortex, ARM9, ARM11 and Mali graphics processors on a multi-year deal.
Brite半导体公司，一个无晶圆厂设计公司，创建于2008年，宣称它获得了ARM Holdings公司的广泛许可，包括cortex,arm9,arm11,以及Mali图形处理器。

Brite (Shanghai, China) said the license also covers Coresight debug and trace technology and peripherals that are compliant with the AMBA on-chip bus.
Brite称该许可包括了Coresight调试和轨迹技术以及遵循AMBA片上总线的外围。

Brite provides design services to electronics companies and works with foundry Semiconductor Manufacturing International Corp. (Shanghai, China) to get those chips made. It also works with design services and IP company Open-Silicon Inc. (Milpitas, Calif.). Open-Silicon invested in Brite and Naveed Sherwani, founder and CEO of Open-Silicon serves on the board of directors of Brite.
Brite为电子制造公司SMI提供设计服务，也为Open－Silicon公司服务，Open-Silicon投资于Brite和Naveed，Open－Silicon的创建者和CEO向Brite公司董事会负责。

"The combination of industry leading ARM technology and Brite's extensive knowledge in design will enable SMIC to continuously provide our mutual customers with complete, full function technology platforms extending down to 45/40nm," said Chris Chi, chief business officer with SMIC, in a statement issued by Brite.
产业领头ARM技术和Brite广泛的设计知识之间的组合将使SMIC可以连续地提供给我们共同的客户完全的技术平台达到45/40nm。

"The agreement lowers the cost barrier for designers of mainstream electronic devices to obtain and integrate popular ARM IPs to achieve optimized designs." said Charlie Zhi, CEO of Brite Semiconductor, in the same statement.
在这份报告中也提到，这份协议将降低主流电子器件的设计者的成本障碍，来获得和整合普及的ARM IP来获得最优化的设计。

只看该作者 · 2011-3-21 19:10

致敬！

只看该作者 · 2011-3-21 22:28

:handshake **呀 LZ

只看该作者 · 2011-3-21 22:51

Gemalto, ST extend collaboration to NFC
Peter Clarke
3/21/2011 7:20 AM EDT

LONDON – Smartcard and security company Gemalto and chip vendor STMicroelectronics have announced they are working together to develop digital security products and services for NFC (Near Field Communications) applications.
智能卡安全公司Gemalto和芯片厂商ST宣布将协同发展近距离通信的数字安全产品与服务。

The two companies have a history of collaboration on products such as ICs for subscriber identity modules (SIM) and secure microcontrollers.
两个公司曾经合作开发过诸如SIM卡IC和安全控制器等产品。

Gemalto NV (Amsterdam, The Netherlands) said the two companies are planning to address the industry's need for a secure element for NFC applications by building on the secure ST33 chipset from ST, specially designed for mobile applications, and Gemalto's secure operating system, mobile handset software, Trusted Service Management and secure personalization services.
荷兰Gemalto公司称两个公司计划基于ST33芯片解决近距离通信的安全性产业需求，尤其是为移动应用设计，Gemalto的安全操作系统，移动手持软件，可靠服务管理和个性化安全服务。

The combination of ST hardware and Gemalto software will accelerate the implementation and adoption of NFC services, including contactless payment, transportation ticketing, personal data protection and device integrity.
ST的硬件与Gemalto的软件合作将加速NFC服务的实施和使用，包括非接触式付费，交通票务，个人数据保护和设备完整性。

Secure hardware developed under the partnership will be available as both a System-in-Package (SIP) version combined with ST's ST21NFCA NFC controller, or as a stand-alone secure element in DFN or micro-SD packages and will offer a range of memory sizes, up to 768-kbytes for applications that can be managed throughout the product lifecycle through innovative memory management.
在这种合作下的安全硬件开发可以是并入ST21NFCA控制器的一个SIP版本，也可以是DFN或者是SD包中的一个独立安全成分，将会提供一些内存容量，最多可达768KByte，通过管理创新的内存管理来管理产品的整个生命周期。

Gemalto was formed in 2005 by the merger of two of the world's largest suppliers of smartcards, Gemplus and Axalto in a share swap deal valued at about $1 billion.
Gemalto成立于2005年，由当时两个世界上最大的智能卡供应商联合而成，Gemplus和Axalto股份交易价值大约为10亿美元。

只看该作者 · 2011-3-22 22:54

Ericsson shrinks cellular modules
Rick Merritt
3/22/2011 7:00 AM EDT
SAN JOSE, Calif. – Ericsson launched two new cellular modules it hopes to get integrated into digital cameras, MP3 players and other consumer devices. The news comes days after rival Sierra Wireless won a deal to integrate one of its cellular modules in a mobile glucose meter.
爱立信启动两款新的蜂窝技术模块，期待可以嵌入数码相机，MP3播放器和其他消费电子器件。该新闻发布于其竞争对手Sierra Wireless公司取得了一个方案将其蜂窝模块潜入一个移动血糖计内。

Ericsson's C5621gw and H5321gw modules, available this fall, are up to 40 percent smaller and consume up to 30 percent less power than previous versions. They are based on a shrink of the ST-Ericsson Thor M5730 modem for HSPA+ and EDGE networks supporting data rates up to 21Mbits/s (download) and 5.76 Mbits/s (upload).
爱立信今秋面试的C5621gw和H5321gw模块，比原来的版本小40％，功耗低30％。基于减小ST-Ericsson Thor M5730 解调器，HSPA和EDGE网络支持数据速率达到下载21Mbps上传5.76Mbps.

Separately, PositiveID Corp. said it built the Wireless AirPrime cellular modules from Sierra Wireless into its iglucose mobile diabetes management system. The iglucose system is a smartphone-size device that links to a separate glucose meter to transmit blood sugar readings to doctors or family members.
另外，PositiveID公司称它从Sierra Wireless血糖管理系统中建立了Wireless AirPrime蜂窝模块，该系统向一个智能手机那么大，连接到独立的血糖计上，用于为医生或家庭成员传输血糖信息。

The Ericsson and PositiveID products--on display at this week's CTIA Wireless event in Orlando, Florida—highlight the increasing penetration of wireless connectivity in consumer products. Carriers such as AT&T and Verizon have courted OEMs in search of more consumer and embedded devices for their networks.
爱立信和PositiveID的产品，亮点在于无线连接消费品。诸如AT&T,Verizon通信商已经吸引了很多制造商，以寻求更多的消费者和嵌入式设备网络。

To date Wi-Fi, not cellular, has led the way in wireless consumer connectivity due to lower chip costs and generally free Wi-Fi services. For example, the Ericsson modules sell for about $40-$60, said Mats Norin, vice president of mobile broadband at Ericsson."Cellular broadband is a newer technology than Wi-Fi, but we are hunting the magic [price] number," he said.
至今为止，WiFi引以其低费用和免费服务领了无线连接。比如爱立信模块卖40到60美元。Cellular宽频是一项比WiFi更新的技术，但是

Wi-Fi radios are "almost free because they are getting integrated into other chips, and people do not want to pay for multiple cellular data plans," said Bob O'Donnell, a senior analyst for clients and displays at International Data Corp.
WiFi几乎免费是因为它将其集成到其他芯片中，人们不想为多Cellular数据付费。

Only about 20 percent of people regularly use and pay for 3G on tablets, accor9idng to an IDC survey. Selling tablets through carriers will be a challenge because consumers would rather use a shared cellular connection than pay for another data plan, O'Donnell said.
只有大约20％的人常规付费3G使用平板电脑，。。。将会是个挑战，因为不想付费。

Ericsson claims it has as many as 25 design wins in tablets for earlier generations of its modules and about 100 design wins in notebooks and netbooks.

只看该作者 · 2011-3-23 22:45

Microsemi enters SSD market
Mark LaPedus
3/22/2011 2:12 PM EDT
SAN JOSE, Calif. - Microsemi Corp. has entered into the solid-state drive (SSD) market.
Microsemi公司进入SSD市场。

The Irvine, Calif.-based chip maker announced initial production and availability of its TRRUST-Stor secure storage device. The SSD is designed from the ground up for aerospace, defense, and military applications. It is aimed at mission critical applications, such as surveillance, data recorders, field computers, digital map storage, avionics, and GPS/communications systems.
宣布其初期产品和TRRUST－Stor安全存储器的实用性。SSD是由宇航，防御，军事应用中发展而来，目标在于执行关键任务，比如监管，数据记录，现场计算机，数字地图存储，航空电子设备和GPS通讯系统。

The SSD gives the user a hardware-based implementation of AES-256 encryption with XTS. Hardware-based authentication enables even higher levels of security. Its so-called ''TRRUST-Purge'' technology erases the keys in under 30-ms, rendering data forensically unrecoverable.
SSD为用户提供硬件XTS的AES－256加密解决方案，硬件鉴别甚至更高级别的安全性。被称为TRRUST－Purge技术在30ms内擦除Key，使得数据不可恢复。

The SSD is said to withstand up to 1700G shock and 30 Grms of vibration. Leveraging Microsemi's Armor flash management processor and IP, product obsolescence is mitigated while allowing for differentiation and customization, according to the analog and mixed-signal chip maker.
SSD据称可以承受1700G撞击和30Grms的振动。

It is manufactured in the United States by a DoD-trusted facility.

''We recognized a need in the defense aerospace segment for secure, highly ruggedized drives with unquestioned data integrity,'' according to a Microsemi spokeswoman. ''This niche was not being met with existing drives on the market.''
我们意识到航空防御部分的安全需要，高可靠性的保证数据完整性。现在市场上还没有器件能满足这个要求。

只看该作者 · 2011-3-24 08:36

good， I am on your side

只看该作者 · 2011-3-24 23:05

Wireless BAN research project aims at health
Peter Clarke
3/23/2011 10:24 AM EDT

LONDON – A European consortium lead by CSEM (Neuchatel, Switzerland) has launched the WiserBAN project, with the objective of developing ultra-miniature RF microsystems for wireless Body Area Networks (BAN).The work is aimed primarily at wearable and implanted devices for health-care, biomedical, wellness and lifestyle applications.
由CSEM引领的一个欧洲团队启动了WiserBAN项目，其目的在于为无线身体网络发明一种超微小的射频微系统。该工作主要在于为卫生保健，生物医学，健康和生活方式应用提供耐用和可移植的器件。

The project includes 12 other partner organizations including hearing aid company Siemens Audiologische Technik GmbH and Debiotech SA of Switzerland. It is looking to develop the following wearable & implantable use cases for a wireless BAN: hearing instruments, cardiac implants, insulin pumps and cochlear implants.
该项目还包括其他12个合作伙伴，包括西门子助听器公司和Debiotech SA。希望能发明出以下耐用和可移植的使用案例：助听器，心脏移植、胰岛素泵和耳蜗植入。

It is set to run for 36 months from Sept. 1, 2010, with a budget of 9.58 million euro (about $13.5 million) of which the European Union is set to provide 6.9 million euro (about $9.8 million).
定在2010年9月1号起的36个月，预算9.58百万欧元，其中欧盟提供6.9百万欧元。

WiserBAN is expected to push wireless beyond state of the art by delivering an ultra-tiny and ultra low-energy radio that will enable WBAN capability and novel product perspectives for wearable and implanted devices for use in lifestyle and bio-medical applications.
WiserBAN有望将无线推动超越现有水平，发送一个超微，超低功耗的广播，使WBAN发挥性能和新奇产品的出现，为生活方式和医学应用带来耐用可移植的器件。

The research is focused on the design and manufacture of an ultra low-power MEMS-based radio SoC, RF and low-frequency MEMS and miniature components, miniature reconfigurable antennas, miniaturized and cost-effective system-in-package, sensor signal processing and flexible communication protocols.
研究的重点是设计和制造的一种极低功率MEMS-based片上系统、RF和低频无线电和微型组件、微型微机电系统(MEMS)的可重构天线，小型化和低成本system-in-package、传感器信号处理和灵活的通信协议。

The ultimate result is expected to be a highly integrated radio-plus-antenna-plus-data processing microsystem.
最终的目的希望高度集成广播加天线加数据处理的微系统。

这里好冷啊，我决定每天都来踩一脚

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